In order to overcome warpage and rough surface issues for moulders, engineering plastics specialist Eurotec has developed Tecomid NAX0 GD50 NL CA (PA 6.6, 50% GRF, heat and UV stabilised). This grade is said to eliminate warpage issues whilst retaining the surface finish of PARA (polyarylamide) resins at mould temperatures as high as 80˚C. The grade is said to have a higher heat deformation temperature then PARA resins and shows better mechanical properties than standard PA6.6 GF50 grades, according to Eurotec. It features the same density as a standard PA6.6 GF50 grade which is 4% lower than a standard PARA GF50 resin.
The group is also making strides in the conductive electronics market. Tecolen OE00 BK EC can be used in film and fibre applications where conductivity is required. While achieving high conductivity with surface resistivity lower than 1Ω.cm, flexibility is not compromised, says the group. The grade has a tensile modulus of 500 MPa and a strain at break higher than 100%. Moreover Tecolen OE00 BK EC can be used either by itself or as a masterbatch for PP, PE and EVA resins. When used as a masterbatch Tecolen OE00 BK EC can modify base resins from permanent antistatic to high conductivities. It can also be used in woven antistatic big bags to create conductive fibres and films or as an electrical conductive masterbatch for PP, PE and EVA based fibres and films.
Eurotec also offers Tecolen OE10 RD018 EC 0B (electrically conductive LDPE) a non-sloughing, transparent grade developed for ESD packaging applications. It also supplies conductive grades compounded with a variety of base resins from engineering to high performance thermoplastics, using assorted formulations to achieve the required electrical conductivity. Non-sloughing, FDA compliant, transparent, electrostatic and paintable grades have all been developed to meet specific customer requirements. The group will be in Hall 7.2, Stand E19 at K 2013.