Shin-Etsu Silicones has launched a grease for thermal engineers to use in electronics cooling.
The CLG Series single-component, pre-cured Gap Filler can be applied across a range of general electronics cooling applications, providing thermal conductivity with no pre-mixing needed.
The greases also have no need to cure, negating need of curing by-products and they have a low volatile content with excellent resistance to pump-out and creeping.
Geoff Thyrum, Shin-Etsu’s Thermal Interface Materials Manager, said: “As electronic devices shrink in size and expand in functionality, the requirements for thermal solutions are ever-increasing. The CLG Series’ economical pre-cured and performance advantages will allow us to optimise new and existing client applications in the growing electronics cooling market segments.”
Shin Etsu Tim conductive grease application
