TWP
AMI's Thin Wall Packaging 2015 begins today May 6th and concludes tomorrow at The Westin Chicago North Shore in Chicago, IL, US.
Thin Wall Packaging 2015 offers a unique networking opportunity to debate the latest developments and market trends in lightweight plastics packaging.
Verstraete’s Business Development Manager North America, Peter Paelinck will present the latest market trends in his presentation ‘Wowing consumers with cool in-mould labels’ on Thursday, May 7th, at 11.00am.
'Differentiation on the shelves’ and ‘New IML market segments’ are just two of the topics up for discussion. Next to the presentation, Verstraete IML will also have a tabletop to share the latest IML innovations.
Peter Paelinck is intimately familiar with the large majority of installed (and planned) IML systems in the US and Canada.
He has attended many TWP editions in the past and said: "Thin Wall Packaging is a great conference that allows you to 'think outside the box' by being confronted with different industry segments each with their own subtleties. I like the fact that the conference is not jam-packed, allowing lots of opportunity for industry networking."
If you wish to meet a Verstraete IML specialist at this event, email us at marketing@verstraete-iml.com or visit our table top at TWP2015. Looking forward to meeting you in Chicago.
