LANXESS will attend the 44th Munich Adhesives and Finishing Symposium (MKVS) in Munich, Germany, this year with an expert presentation on the ‘Advancements in low free (LF) isocyanate prepolymer design for reactive adhesive systems’.
LANXESS Urethane Systems has developed unique prepolymers with < 0.1 wt.% free MDI (methylene diphenyl diisocyanate) and other isocyanates that are used for hot melt adhesives in the automotive, construction, and electronics industries, amongst other applications. This low monomer technology offers outstanding technical performance, exceptional processability and productivity, as well as environmental, health and safety benefits.
The presentation by Gerald King, Head of Technical Services and Application Development Europe, at LANXESS’ Urethane Systems business unit, focuses on the design of low monomer prepolymers for reactive adhesives with a balance between viscosity and NCO content.
King said: “The established way for low monomer hot melts today is a lengthy process with limited flexibility – our approach aims for a flexible formulation platform with customised properties for improved performance and reduced complexity. Our newly developed prepolymers can achieve high NCO content and higher functionality for superior adhesive performance.”
These LF prepolymers are available for all isocyanate and polyol chemicals, including special isocyanates such as IPDI (isophorone diisocyanate), HDI (hexamethylene diisocyanate) and pPDI (p-phenylene diisocyanate). The portfolio also includes a number of polyols such as polyethers, polyesters, polycaprolactones and polycarbonates.
LANXESS’ development focus lies on expanding this LF technology in terms of isocyanates, polyols, range of performance and applications.
The Munich Adhesives and Finishing Symposium is established as the leading independent event in the fields of adhesives, printing and converting industry At this year’s event the focus lies on exchanging insights into the most recent development results and latest technological trends regarding base materials, converting and application of hot melts, hot melt PSAs and extrudable films.